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PSM-66 RIV-11 plugging resin is a halogen-free product.The resin doesn't contain solvents and other harmful volatiles, this paste is a metal-based (aluminium/copper substrate) plugging resin for selective resin plugging holes, can be filled with various styles of slots, plum blossom holes, shaped holes, plugging the holes of the bubble overflow ability, curing rate is fast, easy to grind, anti-stress, drilling holes in the resin without cracks, and has excellent bonding properties.
Fields of application
PSM-66 RIV-11 hole plugging resin is used in aluminium/copper substrate plugging and internal + pressing processes.
Illustration of plug holes for each type of plate
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Technical Specifications
| NO. | Physical indicator | Test Methods | Reference Standard | Test results |
| 1 | Product Appearance | visual assessment | / | Yellowish white |
| 2 | Solid Content | Thermal Weightlessness | GB 1725-79 | 100% |
| 3 | Tg | TMA（℃） | IPC-TM-650 2.4.24 | 135-145 |
| 4 | CTE | TMA（＜Tg）α1（ppm） | IPC-TM-650 2.4.24 | 40-50 |
| TMA（＞Tg）α2（ppm） | IPC-TM-650 2.4.24 | 100-110 | ||
| 5 | Water Absorption | Gravimetric method（%） | IPC-TM-650 2.6.2.1 | <0.1 |
| 6 | Hardness | Pencil method | IPC-TM-650 2.4.27.2 | ≥7H |
| 7 | Insulation Resistance | Voltage method（Ω） | GB/T 10064-2006 | 1-3*1013 |
| 8 | Adhesion | Baige +3m tape method | IPC-TM-650 2.4.1 | 100/100 |
| 9 | Heat-proof material | Reflow soldering 260℃.60sec.3 cycle | IPC-TM-650 2.1.1.2 | Pass |
Thermal Stress 288℃.10sec.5 cycles | IPC-TM-650 2.6.8 | Pass | ||
| 10 | Chemical corrosion resistance | 10wt% NaOH 25℃*30min | IPC-TM-650 2.3.4.3 | Pass |
| 11 | TCT test | -50℃/30minó150℃/30min | IPC-TM-650 2.6.7.2 | Pass |
| 1000cycles | ||||
| 12 | Viscosity （25℃） | VISCOMETER TV-35 | - | 600-800 |
