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PSM-66 RIV-01/02

PSM-66 RIV-01/02 belongs to the conventional halogen-free hole plugging resin, the resin doesn't contain solvents and other harmful volatiles, suitable for vertical machine resin hole plugging process, good bonding with the PCB substrate and copper surface, high heat resistance, low water absorption, easy to grind, and good flatness.


Introductions

公司簡介-深逸通樹脂 - 副本_01.png

Fields of application

PSM-66 RIV01/02 plugging resin is suitable for inner and outer layers, H02, POFV, high thickness-to-diameter ratio, plugging process, mainly for conventional ordinary FR-4 products.

Illustration of plug holes for each type of plate

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Technical Specifications

NO.

Physical

 indicators

Test MethodsReference StandardTest results
1Product Appearancevisual assessment/Yellowish white
2Solid ContentThermal Weightlessness GB 1725-79100%
3TgTMA(℃)IPC-TM-650 2.4.24150-160
4CTE
TMA(<Tg)α1(ppm)IPC-TM-650 2.4.2440-50
TMA(>Tg)α2(ppm)IPC-TM-650 2.4.2495-105
5Water AbsorptionGravimetric method(%)IPC-TM-650 2.6.2.1<0.1
6HardnessPencil methodIPC-TM-650 2.4.27.2≥7H
7Insulation Resistance Voltage method(Ω)GB/T 10064-20061-3*1013
8AdhesionBaige +3m tape methodIPC-TM-650 2.4.1100/100
9Heat-proof material

Reflow soldering

260℃.60sec.3 cycles

IPC-TM-650 2.1.1.2Pass

Thermal Stress

288℃.10sec.5 cycles

IPC-TM-650 2.6.8Pass
10Chemical corrosion resistance 10wt% NaOH 25℃*30minIPC-TM-650 2.3.4.3Pass
11TCT test-50℃/30minó150℃/30minIPC-TM-650 2.6.7.2Pass
1000cycles
12Viscosity(25℃)VISCOMETER TV-06-400-600


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